A novel metallization process for soldering graphite to copper at low temperature

详细信息    查看全文

• 作者：X.G. Song^a ; ^b ; ^{xgsong@hitwh.edu.cn} ; J.H. Chai^b ; S.P. Hu^b ; J. Cao^a ; J.C. Feng^a ; ^b ; D.Y. Tang^c
• 关键词：Graphite ; Metallization ; Soldering ; Microstructure ; Mechanical properties
• 刊名：Journal of Alloys and Compounds
• 出版年：2017
• 出版时间：5 March 2017
• 年：2017
• 卷：696
• 期：Complete
• 页码：1199-1204
• 全文大小：2341 K
• 卷排序：696

文摘

The metallization method provides a neoteric way for joining ceramics to metals. The metallization layer was formed on graphite by adding Cr into SnAgCu alloy. The interfacial microstructure of the metallization layer was β-Sn/Cr3C2/graphite. Reliable brazing of metallized graphite and Cu was achieved at 250 °C for 60s.