In situ synthesis and bonding of TiTiAlTiC/Ni functionally graded materials by field-activated pressure-assisted synthesis process

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• 作者：Shaoping Chen^a ; ^b ; ^{sxchenshaoping@163.com} ; Qingsen Meng^a ; Nan Zhang^a ; Pengfei Xue^a ; Zuhair A. Munir^b
• 关键词：FAPAS ; Reactive synthesis ; Diffusion bonding ; TiAl ; TiC/Ni ; Cermet bonding
• 刊名：Materials Science and Engineering: A
• 出版年：2012
• 出版时间：15 March 2012
• 年：2012
• 卷：538
• 期：Complete
• 页码：103-109
• 全文大小：1708 K

文摘

Employing reactive synthesis and consolidation and using elemental powders as reactants, TiC/Ni cermets were formed and bonded to Ti substrates in one step by a field-activated method. Microstructural observations and EDS analyses revealed well-formed, crack-free bonds between the layers. Bonding between the TiC/Ni cermet and the Ti substrate was facilitated by the formation of TiAl as an intermediate layer, which also formed from the elements during the on-step process.

Shear strength and thermal shock evaluations were made on the resulting samples. The diffusion-bonded interface has a shear resistance of as high as 70.98 MPa and has a good thermal shock resistance. Crack propagation observations indicate high interface strength. The interface between Ti and TiAl has a higher bonding strength than that between the TiC/Ni cermet and TiAl.