Future trends of 3D silicon sensors
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- 作者：Cinzia Da Vi脿 ; Maurizio Boscardin ; Gian-Franco Dalla Betta ; Iain Haughton ; Philippe Grenier ; Sebastian Grinstein ; Thor-Erik Hansen ; Jasmine Hasi ; Christopher Kenney ; Angela Kok ; Sherwood Parker ; Giulio Pellegrini ; Marco Povoli ; Vladislav Tzhnevyi ; Stephen J. Watts
- 关键词：3D silicon sensor ; ATLAS IBL ; LHC upgrade ; Pixels ; Radiation hardness ; Micro-channel cooling
- 刊名：Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
- 出版年：11 December, 2013
- 年：2013
- 卷：731
- 期：Complete
- 页码：201-204
- 全文大小：1082 K
文摘
Vertex detectors for the next LHC experiments upgrades will need to have low mass while at the same time be radiation hard and with sufficient granularity to fulfil the physics challenges of the next decade. Based on the gained experience with 3D silicon sensors for the ATLAS IBL project and the on-going developments on light materials, interconnectivity and cooling, this paper will discuss possible solutions to these requirements.