Accelerated thermo-mechanical fatigue of copper metallizations studied by pulsed laser heating

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• 作者：Stefan Wurster^a ; ¹ ; ² ; Stephan Bigl^a ; ¹ ; ^{stephan-paul.bigl@stud.unileoben.ac.at} ; Megan J. Cordill^b ; Daniel Kiener^a
• 关键词：Copper metallization ; Thermo-mechanical fatigue ; Microstructure ; Laser heating ; Electron backscatter diffraction ; Atomic force microscopy
• 刊名：Microelectronic Engineering
• 出版年：2017
• 出版时间：5 January 2017
• 年：2017
• 卷：167
• 期：Complete
• 页码：110-118
• 全文大小：2666 K
• 卷排序：167

文摘

Laser setup for fast thermal cycling and reliability checks of metallizations on silicon substrates Tracking microstructure and topography site-specifically with electron backscatter diffraction and atomic force microscopy Detailed microstructural and topographical information throughout the entire experiment Four probe resistance measurements demonstrate changes in sheet resistance