Mode I fracture along adhesively bonded sinusoidal interfaces
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- 作者：Fernando A. Cordiscoa ; Pablo D. Zavattieria ; zavattie@purdue.edu" class="auth_mail" title="E-mail the corresponding author ; Louis G. Hector Jr.b ; Blair E. Carlsonb
- 关键词：Sinusoidal interfaces ; Double cantilever beam ; Adhesive joint ; Cohesive zone model ; Crack propagation ; Toughening
- 刊名：International Journal of Solids and Structures
- 出版年：2016
- 出版时间：April 2016
- 年：2016
- 卷：83
- 期：Complete
- 页码：45-64
- 全文大小：5722 K
文摘
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We examine sinusoidally-patterned adhesive joints using DCB geometries.
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All the experiments and simulations consider remote mode-I conditions.
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The sinusoidal DCBs exhibit “stick–slip” conditions during crack propagation.
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Stick–slip is caused by a snapthrough mechanism under displacement control.
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We show that sinusoidal DCBs can be substantially tougher than the flat DCBs.