Viscoplastic characterization and post-rupture microanalysis of a novel lead-free solder with small additions of Bi, Sb and Ni

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• 作者：Q.B. Tao^a ; ^c ; L. Benabou^a ; ^{lahouari.benabou@uvsq.fr} ; V.N. Le^a ; H. Hwang^b ; D.B. Luu^c
• 关键词：Lead-free solder ; Minor alloying additions ; IMC ; Mechanical alloying ; Microstructure ; IGBT
• 刊名：Journal of Alloys and Compounds
• 出版年：2017
• 出版时间：15 February 2017
• 年：2017
• 卷：694
• 期：Complete
• 页码：892-904
• 全文大小：5252 K
• 卷排序：694

文摘

Solder properties are highly dependent on temperature and strain rate. Solder strength is improved with addition of alloying elements Sb, Ni and Bi. Solid solution is formed in Sn with Sb and Bi and new IMCs are formed with Ni. FEM analysis shows improved response of the solder joint in IGBT power module. Microstructure of fracture surfaces are analyzed by SEM and EPMA techniques.