A protocol for fast electroless Ni-P on Al alloy at medium-low temperature accelerated by hierarchically structured Cu immersion layer

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• 作者：Ruixue Kang^a ; ^b ; Zhenjun Peng^a ; Baixing Liu^a ; Daoai Wang^a ; ; Jun Liang^a ; ^{jliang@licp.cas.cn}
• 关键词：Cu immersion ; Deep eutectic solvent ; Accelerator ; Electroless Ni-P ; Medium-low temperature
• 刊名：Surface and Coatings Technology
• 出版年：2017
• 出版时间：15 January 2017
• 年：2017
• 卷：309
• 期：Complete
• 页码：67-74
• 全文大小：1924 K
• 卷排序：309

文摘

Hierarchically structured Cu layer on Al alloy was obtained from ChCl-EG solution. Deposition rate of electroless Ni-P was accelerated by the Cu layer. This would be a simple protocol for fast electroless Ni-P at medium-low temperature. Cu pretreatment can maintain or marginally improve performance of Ni-P coatings. The Cu immersion layer would be an alternative method for Al alloy pretreatment.