A Novel Manufacturing Approach of Phase-change Heat Sink for High-power LED

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• 作者：Zeng Dehuai^a ; ^c ; Liu Yuan^a ; Jiang Lianbo^a ; Li Li^a ; Xu Gang^a ; ^b ; ^{xgrobot@126.com}
• 关键词：Heat removal ; high power LED ; heat sink ; fin structure
• 刊名：Energy Procedia
• 出版年：2012
• 出版时间：2012
• 年：2012
• 卷：17
• 期：Complete
• 页码：1974-1978
• 全文大小：632 K

文摘

Heat removal in packaged high-power light-emitting diode (LED) chips is critical to device performance and reliability. Thermal performance of LEDs is important in that lowered junction temperatures extend the LED's lifetime at a given photometric flux. Optionally, lower thermal resistance can enable increased brightness operation without exceeding the maximum allowable junction temperature for a given lifetime. The goal of this study is to improve the thermal characteristics of high-power LED package by using phase change heat sink. The heat-release characteristics of high-power LED package are analyzed and a novel phase change heat sink with 3D integral-fin boiling structures for high-power LED is developed. Two different fin structures were obtained in grooves formed with chopping-ploughing-extrusion compound forming technology and observed by scanning electron microscope (SEM).