Evolution of bonding interface in Al/Al-Mg-Si alloy clad wire during heating at 500 ℃

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• 作者：Xiang Wang^a ; Ren-Guo Guan^a ; ^b ; ^{15840319082@126.com" class="auth_mail" title="E-mail the corresponding author} ; Ying-Qiu Shang^a ; Wei Wang^a ; Ning Wang^a
• 关键词：Heating ; Interfaces ; Grain boundaries ; Fracture ; Interface bonding strength
• 刊名：Materials Science & Engineering A
• 出版年：2017
• 出版时间：2 January 2017
• 年：2017
• 卷：679
• 期：Complete
• 页码：538-542
• 全文大小：3027 K

文摘

Fusing of bonding interface which could lead to the combination of grains at the both sides of bonding interface, and transition of bonding interface into grain boundary occurred during heating. Both they could strengthen interface bonding, and interface bonding strength was more than doubled after heating for 6 h.