Microstructural evolution and mechanical properties of CuW/CuCr interface with mixed powder interlayers by liquid diffusion bonding technique

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• 作者：Zhe Xiao^a ; ^b ; Xiaohong Yang^a ; ^b ; ^{yangxh2000@126.com} ; Xuejian Li^a ; ^b ; Juntao Zou^a ; ^b ; Shuhua Liang^a ; ^b
• 关键词：Powder interlayer ; Liquid diffusion bonding ; CuW/CuCr dissimilar material ; Microstructures ; Interfacial bonding strength ; Fracture morphology
• 刊名：Vacuum
• 出版年：2017
• 出版时间：March 2017
• 年：2017
• 卷：137
• 期：Complete
• 页码：148-154
• 全文大小：2696 K
• 卷排序：137

文摘

Cu-W composite and CuCr alloy were jointed using Cu-Fe powder interlayers. Diffusion solution layer contributed to strengthening the CuW/CuCr interface. Fe7W6 phase and micro-cracks were found at interface when the excessive Fe was added.