Detailed analysis of surface asperity deformation mechanism in diffusion bonding of steel hollow structural components
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- 作者：C. Zhanga ; b ; H. Lia ; M.Q. Lia ; zc9997242256@126.com" class="auth_mail" title="E-mail the corresponding author
- 关键词：Martensitic stainless steel ; Diffusion bonding ; Surface asperity deformation ; Grain boundary migration ; Void
- 刊名：Applied Surface Science
- 出版年：2016
- 出版时间：15 May 2016
- 年：2016
- 卷：371
- 期：Complete
- 页码：407-414
- 全文大小：3442 K
文摘
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A high quality hollow structural component has been fabricated by diffusion bonding.
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Surface asperity deformation not only expands the interfacial contact areas, but also causes deformation heat and defects to improve the atomic diffusion.
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Surface asperity deformation introduces the stored energy difference between the two opposite sides of interface grain boundary, leading to strain induced interface grain boundary migration.
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The void exerts a dragging force on the interface grain boundary to retard or stop interface grain boundary migration.