The influence of ageing on the stabilisation of interfacial (Cu,Ni)6(Sn,Zn)5 and (Cu,Au,Ni)6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints
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- 作者：Guang Zenga ; Stuart D. McDonalda ; Dekui Mub ; c ; Yasuko Teradad ; Hideyuki Yasudae ; Qinfen Guf ; M.A.A. Mohd Salleha ; g ; Kazuhiro Nogitaa ; k.nogita@uq.edu.au" class="auth_mail" title="E-mail the corresponding author
- 关键词：Solder ; Synchrotron radiation ; X-ray diffraction ; Intermetallics ; Phase transitions
- 刊名：Journal of Alloys and Compounds
- 出版年：2016
- 出版时间：15 November 2016
- 年：2016
- 卷：685
- 期：Complete
- 页码：471-482
- 全文大小：5410 K
文摘
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0.06 wt%Au was not able to suppress interfacial Cu3Sn growth in Sn-0.7Cu/Cu.
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Au remained homogeneously distributed in interfacial (Cu,Au)6Sn5 after 500 h ageing.
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Interfacial Cu6Sn5 phases with a metastable hexagonal generally transform to monoclinic during ageing.
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This transformation during ageing was suppressed by Ni/Au/Zn at different levels.