Nanocrystalline growth and grain-size effects in Au–Cu electrodeposits

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• 作者：Alan F. Jankowski ; Cheng K. Saw ; Jennifer F. Harper ; Bobby F. Vallier ; James L. Ferreira and Jeffrey P. Hayes
• 关键词：Nanostructures ; Growth mechanism ; Structural properties ; Deposition process
• 刊名：Thin Solid Films
• 出版年：2006
• 出版时间：3 January 2006
• 年：2006
• 卷：494
• 期：1-2
• 页码：268-273
• 全文大小：232 K

文摘

The processing–structure–property relationship is investigated for electrodeposited foils of the gold–copper alloy system. A model is presented that relates the deposition process parameters to the nanocrystalline grain size. An activation energy of 1.52 eV atom^{− 1} for growth is determined for a long-pulse (> 10 msec) mode, and is 0.16 eV atom^{− 1} for short pulses (< 5 msec). The effect of nanocrystalline grain size on the mechanical properties is assessed using indentation measurements. A Hall–Petch type variation of the Vickers microhardness with nanocrystalline grain size (> 6 nm) is observed for Au–Cu samples with 1–12 wt. % Cu as tested in cross-section. The hardness increases three-fold from a rule-of-mixtures value < 1 GPa to a maximum of 2.9 GPa.