Growth and residual stresses in the bonded compliant seal of planar solid oxide fuel cell: Thickness design of window frame
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- 作者：Wenchun Jianga ; jiangwenchun@126.com" class="auth_mail" title="E-mail the corresponding author ; Yu-Cai Zhanga ; b ; W.Y. Zhanga ; Y. Luoa ; W. Wooc ; S.T. Tub
- 关键词：Solid oxide fuel cell ; Bonded compliant seal ; Growth stress ; Residual stress ; Neutron diffraction measurement
- 刊名：Materials & Design
- 出版年：2016
- 出版时间：5 March 2016
- 年：2016
- 卷：93
- 期：Complete
- 页码：53-62
- 全文大小：1128 K
文摘
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Growth stress accounts for 40% of residual stress when the substrate thickness exceeds 4 mm.
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Growth stress accounts for about 20% of residual stress when the substrate thickness is below 3 mm.
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The thickness of window frame is designed as 500 μm.