Formation and growth of interfacial intermetallic layers of Sn-8Zn-3Bi-0.3Cr on Cu, Ni and Ni-W substrates

详细信息    查看全文

• 作者：Jiaxing Liang ; Tingbi Luo ; Anmin Hu ; Ming Li
• 刊名：Microelectronics Reliability
• 出版年：January, 2014
• 年：2014
• 卷：54
• 期：1
• 页码：245-251
• 全文大小：2510 K

文摘

In this paper, the formation and growth of intermetallic compounds (IMCs) of Sn-8Zn-3Bi-0.3Cr solder on Cu, Ni and Ni-W substrates have been investigated. For the Cu substrate, only Cu₅Zn₈ intermetallic compound was observed. For the Ni substrate, a Ni₅Zn₂₁ film formed at the interface due to the fast reaction between Ni and Zn. For the Ni-W substrate, a thin Ni₅Zn₂₁ film appeared between the solder and Ni-W layer, whose thickness decreases with the increase of W content. A bright layer was also found to form below the Ni₅Zn₂₁ layer as aging time extended, which is caused by the diffusion of Zn into Ni-W layer.