Intermetallic compounds growth suppression in ZSCB solder with RE addition on Cu substrate
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- 作者：Fei Xing ; Qinghui Shang ; Yuzhen Lu ; Jingwei Liang ; Xiaoming Qiu ; qiuxm13@163.com" class="auth_mail" title="E-mail the corresponding author
- 关键词：Zn&ndash ; Sn&ndash ; Cu&ndash ; Bi&ndash ; RE/Cu ; Interfacial microstructure ; Growth kinetics ; Growth suppression ; Ripening process
- 刊名：Journal of Alloys and Compounds
- 出版年：2016
- 出版时间：5 May 2016
- 年：2016
- 卷：666
- 期：Complete
- 页码：122-130
- 全文大小：4041 K
文摘
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RE has a great effect on improving the shear strength of solder joints.
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The ripening suppression mechanism of ε phase was discussed.
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The activation energy of ε and γ IMCs was also estimated.