Influence of intermetallic growth on the mechanical properties of Zn-Sn-Cu-Bi/Cu solder joints
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- 作者：Fei Xing ; Jia Yao ; Jingwei Liang ; Xiaoming Qiu ; qiuxm13@163.com" class="auth_mail" title="E-mail the corresponding author
- 关键词：High-temperature solder ; Zn&ndash ; Sn&ndash ; Cu&ndash ; Bi solder ; Interfacial microstructure ; Intermetallic growth ; Cleavage fracture
- 刊名：Journal of Alloys and Compounds
- 出版年：2015
- 出版时间：15 November 2015
- 年：2015
- 卷：649
- 期：Complete
- 页码：1053-1059
- 全文大小：3462 K
文摘
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There are four interfacial intermetallic layers formed at the Zn–Sn–Cu–Bi/Cu interface.
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The growth mechanism of ε-CuZn4 intermetallic phase was discussed.
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The wetting time of Zn–Sn–Cu–Bi solder in contact with Cu substrate is a key parameter.