Determination of cure-dependent properties of adhesives by thermal analysis using reaction kinetics and a novel experimental apparatus
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- 作者：M. Schiel ; m.schiel@tu-braunschweig.de" class="auth_mail" title="E-mail the corresponding author ; J. Kahrs ; E. Stammen ; K. Dilger
- 关键词：Curing ; Thermal analysis ; Reaction kinetics ; Adhesive
- 刊名：International Journal of Adhesion and Adhesives
- 出版年：2016
- 出版时间：July 2016
- 年：2016
- 卷：68
- 期：Complete
- 页码：411-417
- 全文大小：1108 K
文摘
This work deals with the determination of cure-dependent mechanical properties, especially the modulus, and the degree of cure. Therefore kinetic methods will be used to determine this degree of cure in addition to the direct measurement by differential scanning calorimetry. Furthermore, the experimental part focuses on the reproducible preparation of samples for dynamic mechanical analysis at different states in the curing reaction. In combination with additional rheological data these different techniques of thermal analysis show a good correlation and offer a deeper understanding of the development of the mechanical properties during cure.