Optimization Method for Double-sided Polishing Process based on Kinematical Analysis

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• 作者：Urara Satake ; ^{satake@cape.mech.eng.osaka-u.ac.jp" class="auth_mail" title="E-mail the corresponding author} ; Toshiyuki Enomoto ; Keitaro Fujii ; Kenji Hirose
• 关键词：Polishing ; Flatness ; Silicon wafer
• 刊名：Procedia CIRP
• 出版年：2016
• 出版时间：2016
• 年：2016
• 卷：41
• 期：Complete
• 页码：870-874
• 全文大小：900 K

文摘

To achieve high surface flatness of silicon wafer in double-sided polishing (DSP) process, kinematical model of DSP process utilizing accurate friction coefficient between wafer and polishing pad was investigated. On the basis of the proposed analytical model, optimization method of a set of rotation conditions of upper/lower platens and inner/outer gears was developed. Optimizations for two types of DSP processes were performed as case study and those results confirmed that the developed optimization method was effective in obtaining the appropriate rotation conditions for achieving high surface flatness of wafer while decreasing the motor load of platens and gears.