Thermodynamic study on the corrosion mechanism of copper wire bonding

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• 作者：Yingzhi Zeng ^{zengyz@ihpc.a-star.edu.sg} ; Kewu Bai ; ^{baikw@ihpc.a-star.edu.sg} ; Hongmei Jin ^{jinhm@ihpc.a-star.edu.sg}
• 刊名：Microelectronics Reliability
• 出版年：2013
• 出版时间：July, 2013
• 年：2013
• 卷：53
• 期：7
• 页码：985-1001
• 全文大小：4094 K

文摘

In order to achieve longer life reliability of copper bonding, it is crucial to understand the corrosion mechanism of copper wire bonding under humid environments. Although it has been revealed that the formation of Al-Cu intermetallic compound (IMC) dominates the bond reliability, the mechanism remains unclear despite considerable efforts by experiments. While Pourbaix (Eh-pH) diagrams have long been used to study the corrosion mechanism of pure metals, the alloy Eh-pH diagrams are still lacking. In this work, by assessing various thermodynamic data of Cu-Al-Cl-H₂O system, we construct the Pourbaix diagrams associated with Cu bonding involving IMCs and study the corrosion behaviors under various environmental parameters such as temperatures and chloride concentrations. We further rationalize the corrosion kinetics of various Al-metal IMCs on the basis of the cation transport model via the calculation of the chemical potentials of aluminum in IMCs. Our study suggests a guideline to enhance bonding corrosion resistance, i.e., improving the thermal stability of IMCs and suppressing the Al vacancy diffusion in Al₂O₃ layer by doping highly charged element(s) in Al pad. The results yield greater insight into the corrosion mechanism which may lead to improving reliability in Cu bonding.