Reactive phase formation and isothermal solidification in the Ni/Au-18.6Si/Ni layer system
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- 作者：C. Leinenbacha ; christian.leinenbach@empa.ch" class="auth_mail" title="E-mail the corresponding author ; N. Weyricha ; M. Stacherb ; K.W. Richterb
- 关键词：Au-Ni-Si phase diagram ; Isothermal solidification ; TLP-bonding ; Soldering
- 刊名：Journal of Alloys and Compounds
- 出版年：2016
- 出版时间：5 December 2016
- 年：2016
- 卷：687
- 期：Complete
- 页码：7-16
- 全文大小：2124 K
文摘
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Isothermal sections at 320 °C and 500 °C in the Au-Ni-Si system were investigated.
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Reactive phase formation in the Ni/Au-18.6.Si/Ni interlayer system was studied.
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Isothermal solidification in interlayer system was studied in cyclic DSC tests.