Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package
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- 作者：Yue Ying Ong ; Soon Wee Ho ; Kripesh Vaidyanathan ; Vasarla Nagendra Sekhar ; Ming Chinq Jong ; Samuel Lim Yak Long ; Vincent Lee Wen Sheng ; Leong Ching Wai ; Vempati Srinivasa Rao ; Jimmy Ong ; Xuefen Ong ; Xi
- 刊名：Microelectronics Reliability
- 出版年：2010
- 出版时间：July 2010
- 年：2010
- 卷：50
- 期：7
- 页码：986-994
- 全文大小：805 K
文摘
This paper reports the design, assembly and reliability assessment of 21 × 21 mm2 Cu/low-k flip chip (65 nm node) with 150 μm bump pitch and high bump density. To reduce the stress from the solder bump pad to low-k layers, Metal Redistribution Layer (RDL) and Polymer Encapsulated Dicing Lane (PEDL) are applied to the Cu/low-k wafer. Lead-free Sn2.5Ag, high-lead Pb5Sn and Cu-post/Sn37Pb bumps are evaluated as the first-level interconnects. It is found that the flip chip assembly of high-lead bumped test vehicle requires the right choice of flux and good alignment between the high-lead solder bumps and substrate pre-solder alloy to ensure proper solder bump and substrate pre-solder alloy wetting. Joint Electron Device Engineering Council (JEDEC) standard reliability is performed on the test vehicle with different first-level interconnects, underfill materials and PEDL.
By integrating PEDL to the Cu/low-k chip, the reliability performance of the flip chip package has been improved by almost two times. This paper has demonstrated Moisture Sensitivity Test-Level 2 (MST-L2) qualified large die and fine-pitch Cu/low-k flip chip package. The presented results are significant for the development of flip chip packaging technologies for future advanced Cu/low-k generations.