It is shown that the analysis of the parameters of LKE and BGI Lorentzians allows to find the values of (Сeq/m′β2), β and [jEVB/(m′β)2] where Сeq is the body-source capacitance, m′ ≈ 1, β is the body factor and jEVB is the density of the EVB current flowing through the gate dielectric.
As a result, the following effects were observed for the first time: (i) (Сeq/m′β2) decreases with increasing gate overdrive voltage V* and depends sub-linearly on the effective fin width Weff under strong inversion conditions; (ii) in depletion and weak inversion where (Сeq/β2) is independent of V* the proportionality (Сeq/β2) ∝ Weff is observed for an effective width Weff 0.87 μm while (Сeq/β2) becomes independent on Weff for Weff < 0.87 μm; (iii) the value of β for the FinFETs investigated is higher than for their planar counterparts; (iv) in spite of the fact that strain affects the barrier height at the Si/SiO2 interface, the EVB current densities jEVB for sSOI and SOI devices are equal; (v) the values of jEVB for the HfSiON/SiO2-devices are much higher than for the HfО2/SiO2-ones studied previously. It is also shown that the gate overdrive voltage V* at which the LKE Lorentzians start to appear is as low as 0.25 V.