Dynamic actuation of polyimide V-groove joints by electrical heating
详细信息 查看全文
- 作者：Ebefors ; T. ; Kä ; lvesten ; E. ; Stemme ; G.
- 关键词：3-D silicon microstructures ; Polyimide joints ; Dynamic actuation ; Electrical heating
- 刊名：Sensors and Actuators A: Physical
- 出版年：1998
- 出版时间：May 15, 1998
- 年：1998
- 卷：67
- 期：1-3
- 页码：199-204
- 全文大小：587 K
文摘
New robust three-dimensional silicon structures with integrated heaters for dynamic actuation have been fabricated and tested. The structures can be used in both static and dynamic modes for 3-D sensor and actuator applications. The proposed technique for bending 3-D structures out of the wafer plane is based on thermal shrinkage of polyimide in V-grooves, producing static bending. This static angle can be chosen in a wide range by varying the curing temperature. The relatively large thermal expansion of polyimide makes it possible to use the structure in dynamic mode. A local power dissipation in the joint is achieved by using a current through an integrated heater. This makes it possible to control the bending angle of each individual structure. For the tested polyimide V-groove joints, static bending angles of 35° and dynamic angles of 3° per V-groove have been achieved.