文摘
New robust three-dimensional silicon structures with integrated heaters for dynamic actuation have been fabricated and tested. The structures can be used in both static and dynamic modes for 3-D sensor and actuator applications. The proposed technique for bending 3-D structures out of the wafer plane is based on thermal shrinkage of polyimide in V-grooves, producing static bending. This static angle can be chosen in a wide range by varying the curing temperature. The relatively large thermal expansion of polyimide makes it possible to use the structure in dynamic mode. A local power dissipation in the joint is achieved by using a current through an integrated heater. This makes it possible to control the bending angle of each individual structure. For the tested polyimide V-groove joints, static bending angles of 35° and dynamic angles of 3° per V-groove have been achieved.