Tangential cathode magnetic field and substrate bias influence on copper vacuum arc macroparticle content decreasing
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- 作者：Igor B. Stepanov ; stepanovib@tpu.ru" class="auth_mail" title="E-mail the corresponding author ; Alexander I. Ryabchikov ; Peter S. Ananin ; Denis O. Sivin ; Alexey E. Shevelev ; Sergei G. Zhelomsky
- 关键词：Vacuum-arc plasma ; Macroparticles ; High-frequency short-pulse negative bias potential ; Steered arc
- 刊名：Surface and Coatings Technology
- 出版年：2016
- 出版时间：25 November 2016
- 年：2016
- 卷：306
- 期：part_PA
- 页码：21-24
- 全文大小：661 K
文摘
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Cu vacuum-arc macroparticles accumulation on substrate was investigated.
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The influence of normal and tangential to cathode magnetic fields was studied.
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The multifold effect of copper macroparticle suppression on biased substrate was shown.
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Applying short-pulsed bias leads to a 250-fold decrease in total macroparticle number.