A Simulation Based Development of Process Signatures for Manufacturing Processes with Thermal Loads

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• 作者：Friedhelm Frerichs^a ; ^{Frerichs@iwt-bremen.de" class="auth_mail" title="E-mail the corresponding author} ; Jens Sö ; lter^a ; ^b ; Thomas Lü ; bben^a ; Ekkard Brinksmeier^a ; ^b ; Hans-Werner Zoch^a ; ^b
• 关键词：Residual Stress ; Grinding ; Induction-heating ; Process Signature
• 刊名：Procedia CIRP
• 出版年：2016
• 出版时间：2016
• 年：2016
• 卷：45
• 期：Complete
• 页码：327-330
• 全文大小：143 K

文摘

The newly developed concept of Process Signatures enables the comparison of surface integrity achieved by seemingly different manufacturing processes. This paper suggests Process Signatures for grinding and induction heating. Based on finite element simulations of both processes the relevant internal material loads are identified and are correlated with the simulated residual stress state. To provide a comparable simulation approach the moving heat source theory is applied and combined with energetic quantities. The investigations show that grinding and induction heating are similar for certain parameter regimes regarding the generated residual stress state of the workpiece surface layer.