High aspect ratio channels in glass and porous silicon

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• 作者：H.D. Liang^a ; ^b ; Z.Y. Dang^a ; J.F. Wu^a ; ^c ; J.A. van Kan^a ; S. Qureshi^a ; M.D. Ynsa^d ; ^e ; V. Torres-Costa^d ; ^e ; A. Maira^d ; T.V. Venkatesan^b ; M.B.H. Breese^a ; ^{phymbhb@nus.edu.sg}
• 关键词：Proton beam irradiation ; High-aspect-ratio channel ; Porous silicon
• 刊名：Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms
• 出版年：2017
• 出版时间：1 March 2017
• 年：2017
• 卷：394
• 期：Complete
• 页码：1-5
• 全文大小：1304 K
• 卷排序：394

文摘

We have developed a micromachining process to produce high-aspect-ratio channels and holes in glass and porous silicon. Our process utilizes MeV proton beam irradiation of silicon using direct writing with a focused beam, followed by electrochemical etching. To increase throughput we have also developed another process for large area ion irradiation based on a radiation-resistant gold surface mask, allowing many square inches to be patterned. We present a study of the achievable channel width, depth and period and sidewall verticality for a range of channels which can be over 100 μm deep or 100 nm wide with aspect ratios up to 80. This process overcomes the difficulty of machining glass on a micro- and nanometer scale which has limited many areas of applications in different fields such as microelectronics and microfluidics.