Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy SVM algorithm
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- 作者：Mengying Fana ; Li Weib ; Zhenzhi Hea ; c ; Wei Weia ; Xiangning Lua ; lxnam89@163.com" class="auth_mail" title="E-mail the corresponding author
- 关键词：Fuzzy SVM algorithm ; Defect inspection ; Solder bump ; Scanning acoustic microscopy
- 刊名：Microelectronics Reliability
- 出版年：2016
- 出版时间：October 2016
- 年：2016
- 卷：65
- 期：Complete
- 页码：192-197
- 全文大小：2079 K
文摘
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We develop an intelligent diagnosis system for defect inspection of solder bumps.
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The SAM image is segmented based on the gray gradient of the original image.
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The SVM algorithm with fuzzy memberships is investigated.
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The F-SVM is used to solve the solder bumps classification and recognition.
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The results prove the effectiveness of the intelligent diagnosis system.