Automatized failure analysis of tungsten coated TSVs via scanning acoustic microscopy
详细信息 查看全文
- 作者：E. Grü ; nwalda ; J. Rosca ; R. Hammera ; P. Czurratisb ; M. Kochb ; J. Kraftc ; F. Schrankc ; R. Brunnera ; roland.brunner@mcl.at" class="auth_mail" title="E-mail the corresponding author
- 关键词：Microelectronics ; Ultrasound ; EFIT simulations ; TSVs
- 刊名：Microelectronics Reliability
- 出版年：2016
- 出版时间：September 2016
- 年：2016
- 卷：64
- 期：Complete
- 页码：370-374
- 全文大小：917 K
文摘
- •
The paper Automatized Failure Analysis of Tungsten Coated TSVs via Scanning Acoustic Microscopy highlights the analysis of 3D integrated microelectronics. In detail TSV structure are analyzed by using scanning acoustic microscopy, computed tomography and ultrasound simulations.
- •
It is shown in the article that acoustic microscopy presents a highly valuable tool for the characterization of TSV structures.