Broad ion beam serial section tomography

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• 作者：B. Winiarski^a ; ^b ; ¹ ; ^{b.winiarski@manchester.ac.uk} ; A. Gholinia^a ; K. Mingard^b ; M. Gee^b ; G.E. Thompson^a ; P.J. Withers^a
• 关键词：3D electron back scattered diffraction ; Ion beam polishing ; Scanning electron microscopy ; Focused ion beam (FIB) ; Computed tomography (CT) ; Cermet
• 刊名：Ultramicroscopy
• 出版年：2017
• 出版时间：January 2017
• 年：2017
• 卷：172
• 期：Complete
• 页码：52-64
• 全文大小：2890 K
• 卷排序：172

文摘

In this work we examine how microstructures can be reconstructed in three-dimensions (3D) by serial argon broad ion beam (BIB) milling, enabling much larger volumes (>250×250×100µm3) to be acquired than by serial section focused ion beam-scanning electron microscopy (FIB-SEM). The associated low level of damage introduced makes BIB milling very well suited to 3D-EBSD acquisition with very high indexing rates. We explore and compare for the first time the application of Broad Ion Beams (BIBs) using the Gatan PECS and Ilion systems for large volume serial sectioning and 3D-EBSD data acquisition. Volumetric data registration schemes usually assume that the data comprises a series of parallel, planar slices. We quantify the variations in slice thickness and parallelity which can arise when using BIB systems. Raw 3D-EBSD data is affected by distortions and artefacts arising from serial sectioning such that quantitative analyses and visualisation can give misleading and erroneous results. Addressing and correcting these issues offer real benefits in understanding microstructures reconstructed by 3D-EBSD.