Effects of Ag addition on solid-state interfacial reactions between Sn-Ag-Cu solder and Cu substrate

详细信息    查看全文

• 作者：Ming Yang^a ; Yong-Ho Ko^a ; ^b ; Junghwan Bang^a ; Taek-Soo Kim^b ; Chang-Woo Lee^a ; ^{cwlee@kitech.re.kr} ; Mingyu Li^c ; ^{myli@hit.edu.cn}
• 关键词：Pb&ndash ; free solder ; Low&ndash ; Ag&ndash ; content solder ; Solid&ndash ; state reaction ; Crystal growth ; Diffusion kinetics
• 刊名：Materials Characterization
• 出版年：2017
• 出版时间：February 2017
• 年：2017
• 卷：124
• 期：Complete
• 页码：250-259
• 全文大小：2783 K
• 卷排序：124

文摘

Role of Ag in IMC formation during Sn–Ag–Cu soldering was investigated. Ag affects coarsening, crystallographic orientation, and IMC growth. Diffusion pathways of Sn and Cu are affected differently by Ag. Ag slows Cu diffusion to inhibit IMC growth at solder/substrate interface.