Dispersion of surface-modified silica nanoparticles in polyamide-imide (PAI) films for enhanced mechanical and thermal properties

详细信息    查看全文

• 作者：Taeho Kang ; John Hwan Lee ; Seong-Geun Oh ; ^{seongoh@hanyang.ac.kr}
• 关键词：Surface-modified silica nanoparticles ; p-Aminophenyltrimethoxysilane ; Nanocomposite films ; Thermal stability ; Mechanical properties
• 刊名：Journal of Industrial and Engineering Chemistry
• 出版年：2017
• 出版时间：25 February 2017
• 年：2017
• 卷：46
• 期：Complete
• 页码：289-297
• 全文大小：2714 K
• 卷排序：46

文摘

Silica modified with aminophenyl groups were prepared by two-step sol–gel process. Modified silica nanoparticles were dispersed into polyamide-imide (PAI) films. Decomposition temperature of PAI films was increased with modified silica nanoparticles. Tensile strength and elongation at break point of films were improved with silica particles.