Morphologies and wetting properties of copper film with 3D porous micro-nano hierarchical structure prepared by electrochemical deposition
详细信息 查看全文
- 作者：Hongbin Wang ; Ning Wang ; Tao Hang ; hangtao@sjtu.edu.cn" class="auth_mail" title="E-mail the corresponding author ; Ming Li ; mingli90@sjtu.edu.cn" class="auth_mail" title="E-mail the corresponding author
- 关键词：Hierarchical structure ; Porous film ; Electrochemical deposition ; Morphology ; Super-hydrophobicity
- 刊名：Applied Surface Science
- 出版年：2016
- 出版时间：30 May 2016
- 年：2016
- 卷：372
- 期：Complete
- 页码：7-12
- 全文大小：2143 K
文摘
- •
A 3D porous micro-nano hierarchical structure Cu films were prepared.
- •
The evolution of morphology and wettability with deposition time was reported.
- •
The effects of EDA on the microscopic morphology were revealed.
- •
A high contact angle of 162.1° was measured when deposition time is 5 s.
- •
The mechanism of super-hydrophobicity was illustrated by two classical models.