Effects of salt spray test on lead-free solder alloy
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- 作者：A. Gué ; don-Graciaa ; alexandrine.gracia@ims-bordeaux.fr" class="auth_mail" title="E-mail the corresponding author ; H. Fré ; monta ; B. Planoa ; J.-Y. Delé ; tagea ; K. Weide-Zaageb
- 关键词：Solder joints ; Electronic assembly ; Corrosion
- 刊名：Microelectronics Reliability
- 出版年：2016
- 出版时间：September 2016
- 年：2016
- 卷：64
- 期：Complete
- 页码：242-247
- 全文大小：1341 K
文摘
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Study of corrosion on lead-free solder balls during salt spray tests
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SnAgCu solder alloys analysed along the ageing.
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Tin oxychloride (Sn(OH)Cl) detected as major corrosion product.
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The size of the solder balls has an influence on the corrosion state.