Design, simulation and testing of electrostatic SOI MUMPs based microgripper integrated with capacitive contact sensor

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• 作者：Shafaat Ahmed Bazaz^a ; Fahimullah Khan^a ; ^{fah_engineer@yahoo.com} andRana Iqtidar Shakoor^b [Author vitae]
• 关键词：Microgripper ; Micromanipulation ; Finite element analysis ; SOI-MUMPs ; Contact sensor ; Modal analysis
• 刊名：Sensors and Actuators A: Physical
• 出版年：2011
• 出版时间：May 2011
• 年：2011
• 卷：167
• 期：1
• 页码：44-53
• 全文大小：2840 K

文摘

In this paper a detailed modeling, simulations and testing of a novel electrostatically actuated microgripper integrated with capacitive contact sensor is presented. Microgripper is actuated with lateral comb drive system and transverse comb system is used to sense contact between micro-object and microgripper jaws. The design is optimized in standard SOI-MUMPs micromachining process using L-Edit of MEMS-Pro. Finite element analysis of microgripper is performed in COVENTOR-WARE which shows total displacement of 15.5 μm at the tip of jaws when voltage of 50 V_dc is applied at the actuator. Finite element analysis of sensor part is performed and results are compared with analytical model. Modal analysis is performed to investigate mode shapes and natural frequencies of the microgripper. Microgripper is tested experimentally and total displacement of 17 μm is achieved at the tip of microgripper. The slight difference between finite element analysis and experimental results is due to small variations in the material properties, deposited during the fabrication process. The change in capacitance of capacitive contact sensor is linearly calibrated with the change in the displacement. The sensitivity of contact sensor is 90 fF/μm. The total size of microgripper is 5.03 mm × 6.5 mm.