Interfacial reactions at the joints of CoSb₃-based thermoelectric devices

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• 作者：Sinn-wen Chen ; ^{swchen@mx.nthu.edu.tw} ; Alan Hwader Chu ; David Shan-Hill Wong
• 关键词：CoSb3 ; Ag-Cu ; Barrier layer (Co ; Ni ; Ti) ; Interfacial reaction ; Braze
• 刊名：Journal of Alloys and Compounds
• 出版年：2017
• 出版时间：30 March 2017
• 年：2017
• 卷：699
• 期：Complete
• 页码：448-454
• 全文大小：3577 K
• 卷排序：699

文摘

The Ag-39.9 at%Cu alloy reacts significantly with the CoSb3 substrate. The Ag-39.9 at%Cu/Ni (or Co or Ti) interfacial reactions at 450 °C are examined. The Ag-39.9 at%Cu/Ni (or Co or Ti) interfacial reactions at 600 °C are examined. Ag-39.9 at%Cu/Ti reaction rates are faster comparing those with Co and Ni. Co is a good barrier layer for the CoSb3 modules when Ag-Cu eutectic is used.