Influence of die-shift-distance of overhang dies on residual thermal shear stress in 5-chip SiP after EMC curing
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- 作者：Wei-Hua Lua ; Jhih-Hao Lina ; Chuen-Shii Choub ; cschou@mail.npust.edu.tw" class="auth_mail" title="E-mail the corresponding author
- 关键词：Stacked-die system-in-packaging ; Overhang die ; Die-shift-distance ; Shear strain energy density
- 刊名：Materials & Design
- 出版年：2016
- 出版时间：15 February 2016
- 年：2016
- 卷：92
- 期：Complete
- 页码：512-521
- 全文大小：1818 K
文摘
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Die-shift-distance of overhang die has a substantial influence on the rigidity of stacked dies.
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Die-shift-distance of overhang die affects the value and position of τmax at EMC/die interface in 5-chip SDSiP.
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Surface of 5-chip SDSiP becomes convex due to CTE mismatch between materials.