Risk assessment of the crack propagation and delamination of the Cu-to-Cu direct bonded (CuDB) interface

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• 作者：Ah-Young Park^a ; ^{apark10@binghamton.edu} ; Satish C. Chaparala^a ; ^b ; SeungBae Park^a
• 关键词：Cu-to-Cu direct bonding ; Crack ; Delamination ; Finite element analysis (FEA) ; Fracture mechanics ; Reliability
• 刊名：Microelectronics Reliability
• 出版年：2016
• 出版时间：November 2016
• 年：2016
• 卷：66
• 期：Complete
• 页码：113-121
• 全文大小：1887 K
• 卷排序：66

文摘

The outermost left crack at the interface of the CuDB shows the highest risk of crack propagation. The increase of area fraction of the copper is the most crucial factor to reduce warpage of the package. In-plane tension plays a crucial role in crack propagation. The CuDB diameter is the dominant factor that affects the SERR at the crack tip, followed by the initial crack length and the pitch. Small voids of 0.5–1.25 μm in the CuDB are acceptable without risk of crack propagation and delamination.