Influence of the chemical composition in SiNx films on silver paste contact formation at silicon surface
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- 作者：X.Y. Chen ; yz.chenxy@jasolar.com" class="auth_mail" title="E-mail the corresponding author ; W.J. Xue ; W.Z. Ban ; X.L. Jiang ; W. Shan
- 关键词：Silicon nitride ; Contact resistance ; Ag paste ; Glass frits
- 刊名：Solar Energy
- 出版年：2016
- 出版时间：March 2016
- 年：2016
- 卷：126
- 期：Complete
- 页码：105-110
- 全文大小：1272 K
文摘
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Rs of Ag paste to Si depended on the chemical composition of SiNx film.
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Small Ag particles embedded in the frits causing contact resistance decreased.
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Si–Si bond in SiNx film suppressed the silver paste penetrating the SiNx film.