Copper circuit patterning on polymer using selective surface modification and electroless plating

详细信息    查看全文

• 作者：Sang Jin Park^a ; Tae-Jun Ko^b ; ^d ; Juil Yoon^c ; Myoung-Woon Moon^b ; Kyu Hwan Oh^d ; Jun Hyun Han^a ; ^{jhhan@cnu.ac.kr}
• 关键词：Flexible electronics ; Plasma treatent ; Microstructure ; Electroless plating ; Cu circuit
• 刊名：Applied Surface Science
• 出版年：2017
• 出版时间：28 February 2017
• 年：2017
• 卷：396
• 期：Complete
• 页码：1678-1684
• 全文大小：2431 K
• 卷排序：396

文摘

A new simple two step method for the pattering of Cu circuits on PET substrate was proposed. The simple patterning of the high adhesive Cu circuits was achieved by plasma treatment using a patterned mask coated with a catalyst material. The high adhesive strength of Cu circuits was due to the nanostructure formed by oxygen plasma treatment.