[INVITED] A review: Warm laser shock peening and related laser processing technique

详细信息    查看全文

• 作者：Yiliang Liao^a ; ^{yliao@unr.edu" class="auth_mail" title="E-mail the corresponding author} ; Chang Ye^b ; Gary J. Cheng^c
• 关键词：Warm laser shock peening ; Thermal engineered laser shock peening ; Materials processing ; Fatigue life ; Microstructure evolution
• 刊名：Optics & Laser Technology
• 出版年：2016
• 出版时间：April 2016
• 年：2016
• 卷：78
• 期：part_PA
• 页码：15-24
• 全文大小：10690 K

文摘

This paper reviews the recent progress in warm laser shock peening (WLSP) and related laser processing technique. The process design, enhanced mechanical performance, and microstructure evolution of WLSP are discussed in details. The fundamental process mechanism is reviewed by building the processing-microstructure-property relationship. In particular, the precipitation kinetics during WLSP is discussed to study the effect of process parameters on the nucleation of nano-precipitates, and multiscale discrete dislocation dynamics (MDDD) simulation results are summarized to investigate the dislocation multiplication and propagation behaviors as well as the dislocation pinning effect. In addition, the research progress of thermal engineered laser shock peening (TE-LSP) technique is reviewed with a focus on the coarsening of precipitates, the extended fatigue life, and more importantly, the fundamental process mechanism.