Simulation of thermal dissipation in a μ-processor using carbon nanotubes based composite

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• 作者：Bui Hung Thang^a ; Phan Ngoc Hong^a ; Pham Van Trinh^a ; Nguyen Van Chuc^a ; Ngo Thi Thanh Tam^a ; Phan Hong Khoi^a ; Phan Ngoc Minh ; ^a ; ^{minhpn@ims.vast.ac.vn"" rel=""nofollow}
• 关键词：MWCNTs ; CNTs based composite ; Thermal compound ; μ ; -Processor ; Thermal dissipation
• 刊名：Computational Materials Science
• 出版年：2010
• 出版时间：October 2010
• 年：2010
• 卷：49
• 期：4, Supplement 1
• 页码：S302-S306
• 全文大小：966 K

文摘

Currently, the problem of thermal dissipation material for μ-processors, high power lasers and other electronic devices becomes a very important issue. In a computer processor, thermal compound between the processor and the cooling fan becomes a key factor in the thermal dissipation process. Therefore, finding a thermal compound having high thermal conductivity is becoming a major challenge. It is known that carbon nanotubes (CNTs) is one of the most valuable materials with high thermal conductivity (2000 W/m K compared to thermal conductivity of Ag 419 W/m K). This suggested a new approach in applying the CNTs as an essential component to improve the performance of the computer processor and other high power electronic devices. In this paper, we present the simulation and experimental results of thermal dissipation efficiency using the multi-walled carbon nanotubes (MWCNTs) based composites as the thermal dissipation media in the μ-processor of a personal computer. We used simulation approach to study thermal dissipation process in the μ-processor, and the relation between the temperature of the processor and cooling fan, thermal conductivity of thermal paste and working time. A personal computer with configuration: Intel Pentium IV 3.066 GHz, 512 Mb of RAM and Windows XP Service Pack 2 Operating System was employed. The thermal dissipation efficiency of the system was evaluated by directly measuring the temperature of the μ-processor during the operation of the computer. The experimental and simulation results showed that the CNTs based composite could reduce the temperature of the μ-processor more than 3 °C, and the thermal conductivity of the CNTs thermal paste was two times higher than that of the commercial thermal paste.