Shock-wave-induced Thin-film Delamination (SWIFD): A Non-thermal Structuring Method of Functional Layers

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• 作者：Pierre Lorenz ; ^{pierre.lorenz@iom-leipzig.de" class="auth_mail" title="E-mail the corresponding author} ; Martin Ehrhardt ; Lukas Bayer ; Klaus Zimmer
• 关键词：Laser-induced delamination process ; laser structuring ; flexible substrate ; thin layer etching
• 刊名：Physics Procedia
• 出版年：2016
• 出版时间：2016
• 年：2016
• 卷：83
• 期：Complete
• 页码：240-248
• 全文大小：1103 K

文摘

The laser structuring of thermally sensitive functional layers is a challenge for laser methods. However, already ultrashort laser pulses can induce thermal modifications. The spatial separation of the laser pulse absorption from the functional layer removal process allows a non-thermal structuring process. Therefore, the rear side of the substrate is irradiated and the following laser ablation process induces a transverse shock wave through the substrate. Finally, the interaction of the shock wave with the substrate/functional layer interface results in a delamination of the functional layer. This shock-wave-induced thin-film delamination (SWIFD) method was tested on a layer system (1.5 μm thick epoxy-based negative photoresist SU 8, 250 nm–1 μm chromium layer) on a 25 μm polyimide flexible substrate where the influence of the systematic variation of the thickness of the metallic intermediate layer on the delamination process was studied. The resultant surface morphology was analyzed by optical microscopy as well as by white light interferometry (WLI).