Temperature determination of tilted electronic assemblies equipped with basic and wire-bonded QFN16 and 32 devices subjected to free convection
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- 作者：A. Baï ; ri abairi@u-paris10.fr" class="auth_mail" title="E-mail the corresponding author bairi.a@gmail.com" class="auth_mail" title="E-mail the corresponding author
- 关键词：Thermal control ; Free convection ; Electronics ; Quad Non Flat devices QFN16 ; QFN32 ; Packaging ; Engineering applications
- 刊名：Applied Thermal Engineering
- 出版年：2016
- 出版时间：5 June 2016
- 年：2016
- 卷：102
- 期：Complete
- 页码：565-569
- 全文大小：498 K
文摘
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Correlations are proposed to calculate the temperature on electronic assemblies.
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Four QFN electronic packages are considered: QFN16, QFN32, QFN16b and QFN32b.
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The power generated by the active devices ranges between 0 W (device off) and 1 W.
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The inclination angle of the Printed Circuit Board and QFN varies between 0° and 90°.
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The correlations easy to use helps improving the QFN thermal design and reliability.