Material removal mechanism in ultrasonic vibration assisted polishing of micro cylindrical surface on SiC
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- 作者：Qingliang Zhao zhaoqingliang@hit.edu.cn" class="auth_mail" title="E-mail the corresponding author ; Zhiyuan Sun zhiyuanszy@163.com" class="auth_mail" title="E-mail the corresponding author ; Bing Guo ; guobing@hit.edu.cn" class="auth_mail" title="E-mail the corresponding author
- 关键词：Ultrasonic vibration assisted polishing ; Micro cylindrical surface ; Silicon Carbide (SiC) ; Material removal mechanism ; Friction behavior ; Abrasion behavior
- 刊名：International Journal of Machine Tools and Manufacture
- 出版年：2016
- 出版时间：April 2016
- 年：2016
- 卷：103
- 期：Complete
- 页码：28-39
- 全文大小：8914 K
文摘
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Ultrasonic vibration could reduce friction force result in improve surface quality.
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The contact model of ultrasonic vibration assisted polishing was established.
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The introduction of ultrasonic vibration could decrease two-body abrasion.
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Increase vibration frequency and amplitude could improve micro-structures quality.
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The cylindrical arrays were successfully polished with the optimized parameters.