The adhesion of Pd is much better than Au on H-diamond.
The Pd contact shows excellent thermal stability up to 700 °C.
The minimum specific contact resistance is evaluated to be 4.93 × 10−7 Ω cm2 at 400 °C.
The barrier height is − 0.15 eV and − 0.03 eV for as-deposited and annealed sample.
HNO3 vapor surface treatment before evaporation is found to reduce the specific contact resistance.