Adsorption of Pd nanoparticles catalyst in high aspect ratio through-Si vias for electroless deposition

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• 作者：Fumihiro Inoue ; Tomohiro Shimizu ; Hiroshi Miyake ; Ryohei Arima ; Toshihiko Ito ; Hirofumi Seki ; Yuko Shinozaki ; Tomohiko Yamamoto ; Shoso Shingubara
• 关键词：Electroless plating ; Nanoparticles ; Pd catalyst ; Through Si via (TSV) ; Barrier metal
• 刊名：Electrochimica Acta
• 出版年：2012
• 出版时间：1 November, 2012
• 年：2012
• 卷：82
• 期：Complete
• 页码：372-377
• 全文大小：1249 K

文摘

We studied electroless Co-W-B plating in through-Si vias (TSVs) using Pd nanoparticles (Pd-NPs) as a catalyst. The density of adsorbed Pd-NPs on SiO₂ in the high aspect ratio TSVs was over 8500/¦Ìm² after a long adsorption treatment. No Pd-NP agglomeration was observed. In contrast, agglomerates of large particles were observed after a conventional Sn-Pd colloid adsorption treatment. Using a Pd-NP catalyst, we succeeded in the formation of a thin continuous electroless Co-W-B barrier layer in high aspect ratio TSVs. The adhesion strength of the Co-W-B layer increased with increasing particle density of the Pd-NPs. These results indicate that the process with Pd-NPs catalyst is a promising method for the formation of a thin barrier layer in high aspect ratio TSVs at low temperatures.