Approaching ultra-low thermal conductivity in β-SiC nanoparticle packed beds through multiple heat blocking mechanisms

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• 作者：Peng Wan^a ; ^b ; Liyin Gao^a ; ^b ; Jingyang Wang^a ; ^{jywang@imr.ac.cn" class="auth_mail" title="E-mail the corresponding author}
• 关键词：Nanostructured SiC ; Low thermal conductivity ; High thermal stability
• 刊名：Scripta Materialia
• 出版年：2017
• 出版时间：February 2017
• 年：2017
• 卷：128
• 期：Complete
• 页码：1-5
• 全文大小：1013 K

文摘

The crucial challenge for oxide thermal insulators, such as Al₂O₃ and SiO₂ nano-particle aggregates, is to solve the trade-off between extremely low thermal conductivity and unsatisfied sintering stability. We herein report the ultra-low thermal conductivities (0.068–0.1 W m^− 1 K^− 1) of β-SiC nanoparticle (~ 35 nm) packed beds. The breakthrough is realized by multiple heat blocking mechanisms in the nanostructures. The samples also possess good thermal stability as high as 1500 °C. Our results provide a new strategy to explore ultra-low thermal conductivity materials with excellent thermal stability, regardless of their high intrinsic lattice thermal conductivities.