Enhanced thermal conductive 3D-SiC/Al-Si-Mg interpenetrating composites fabricated by pressureless infiltration

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• 作者：Dongmei Wang^a ; ^b ; Zhixiang Zheng^a ; Jun Lv^a ; ^b ; Guangqing Xu^a ; ^c ; Shiang Zhou^a ; ^c ; Wenming Tang^a ; ^b ; Yucheng Wu^a ; ^b ; ^c ; ^{ycwu@hfut.edu.cn}
• 关键词：High thermal conductivity ; Pressureless infiltration ; 3D-SiC/Al-Si-Mg interpenetrating composite
• 刊名：Ceramics International
• 出版年：2017
• 出版时间：1 February 2017
• 年：2017
• 卷：43
• 期：2
• 页码：1755-1761
• 全文大小：1740 K
• 卷排序：43

文摘

A high thermal conductive 3D-SiC/Al-Si-Mg interpenetrating composite (IPC) with three dimensional mutually interpenetrated structure was fabricated by mold-forming and pressureless infiltration method. Al-15Si-10Mg was used as the infiltration aluminum alloy. The obtained composite was treated with a T6 procedure. The composed phases, microstructure, thermal conductivity, mechanical strength and fractography of the prepared 3D-SiC/Al-Si-Mg IPC were either analyzed or measured with X-ray diffraction (XRD), optical metallography, laser thermal conductivity instrument, universal testing machine, field emission electron scanning microscopy (SEM) with energy dispersive spectroscopy (EDS), high-resolution transmission electron microscopy (HRTEM), and etc. The results showed that both SiC ceramic and aluminum alloy phases distribute evenly and form a three-dimensional mutually interpenetrated structure in the obtained IPC. No clear brittle and harmful Al4C3 phase was found in the composite. The obtained IPC contains a SiC volume fraction of 67 vol% and has the properties of a density of 3.02 g/cm2, a thermal conductivity of 233.6 W/(m °C), a thermal expansion coefficient (RT~300 °C) of 7.03×10−6/°C and a bending strength of 288 MPa.