Effect of ultrasonic vibration time on the Cu/Sn-Ag-Cu/Cu joint soldered by low-power-high-frequency ultrasonic-assisted reflow soldering
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- 作者：Ai Ting Tan aiting2602@gmail.com" class="auth_mail" title="E-mail the corresponding author ; Ai Wen Tan aiwen_2101@hotmail.com" class="auth_mail" title="E-mail the corresponding author ; Farazila Yusof ; farazila@um.edu.my" class="auth_mail" title="E-mail the corresponding author
- 关键词：Ultrasonic soldering ; Vibration time ; Reflow ; Lead-free ; Microstructure ; Mechanical properties
- 刊名：Ultrasonics Sonochemistry
- 出版年：2017
- 出版时间：January 2017
- 年：2017
- 卷：34
- 期：Complete
- 页码：616-625
- 全文大小：5557 K
文摘
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A low-power-high-frequency ultrasonic-assisted reflow soldering was established.
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Cu/Sn-Ag-Cu/Cu solder joints were fabricated under the influence of ultrasound.
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The effect of ultrasonic vibration time on the solder joint properties was studied.
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The solder joint microstructure altered significantly after the ultrasonic treatment.
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The shear strength of the solder joints was improved after the ultrasonic treatment.